JPCA Show / ラージエレクトロニクスショー / WIRE Japan Show /
マイクロエレクトロニクスショー / JISSO PROTEC / ものつくりフェスタ

2015年6月5日（金）　　東6ホール 特設会場　　無料　同時通訳有

6月5日（金）

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  国際機関における化学物質規制の歴史と国の対応

  北野　大 氏

  淑徳大学　人文学部　表現学科　東京図書館長　教授

   Profile

  (学歴等）
  1942　東京都に生まれる
  1972　東京都立大学　大学院　工学研究科　工業化学専攻　博士課程　修了　(工学博士）
  　　　  学位論文
  　　　　　　  光分解ガスクロマトグラフィーの研究

  (財）化学物質評価研究機構　企画管理部長を経て
  1994　淑徳短期大学　食物栄養学科　教授
  1996　淑徳大学　　国際コミュニケーション学部　経営環境学科　教授
  2004　同　人間環境学科　教授
  2006　明治大学　理工学部　応用化学科　同　大学院　理工学研究科　応用化学専攻　教授
  　　　  同大学院理工学研究科新領域創造専攻　教授
  2013　淑徳大学　総合福祉学部　教授
  2014　淑徳大学　人文学部　表現学科　教授

  (公職）
  江戸川総合人生大学　学長
  専門）
  環境化学、リスクコミュニケーション
  (著書）
  人間・環境･安全（共立出版）ごみ・リサイクル・ダイオキシン（研成社）
  環境くらし学（研成社）
  循環型社会への提言（研成社）
  資源・エネルギーと循環型社会（三共出版）
  暮らしと環境科学（東京化学同人）
  環境科学(東京化学同人）
  環境と生命(三共出版）
  安全学入門　Ⅰ、Ⅱ、Ⅲ（研成社）
  化学物質と正しく付き合う方法（化学工業日報）　など多数
  (所属学会）
  日本化学会、環境科学会、日本分析化学会、水環境学会
  (受賞）
  2004年度　日本分析化学会　技術功績賞
  「化学物質の分析化学的安全性評価手法の開発と普及」
  2006年度　　環境科学会　学会賞
  「環境コミュニケーションの実践的活動と環境科学会発展への貢献」
  2008年度　環境功労者として環境大臣表彰を受ける

  ・人間環境（ストックホルム）宣言、OECD化学品プログラムからの歴史的背景
  ・ストックホルム条約、化審法の運用状況

• はんだを用いない実装技術に期待される効果の検証
  An Examination of the Prospective Benefits of Manufacturing Electronic Assemblies Without Solder

  Mr. Joseph Fjelstad

  Founder
  Verdant Electronics

   Profile

  Joseph Fjelstad, founder and CEO of Verdant Electronicss is a 45 year veteran of the electronics interconnection industry. He has authored or coauthored several books on the topic including Flexible Circuit Technology, globally the most widely read book on the subject matte and Chip Scale Packaging for Microelectronics. Mr Fjelstad is also a prolific inventor with more than 175 US patents issued in his name and with many of the ideas disclosed in those patents now in wide use around the globe in electronic products of every type. His present company, Verdant Electronics, is focused on and is championing the idea of eliminating solder from the electronics manufacturing paradigm by, in essence, reversing the manufacturing process to make products that will be at once more economical, more environmentally friendly and more reliable though the elimination of what is recognized as the number one cause of electronics failure, the venerable but technically and physically limited solder joint.

  Solder has been the primary method for interconnecting electronic assemblies for well over half a century. While solder has served its intended purpose in a suitable manner over the decades, solder joints are known to be the primary sites of electronic system failures. This presentation will explore and examine prospective methods for making electronic assemblies without the use of solder under a new paradigm called SAFE (Solder Alloy Free Electronics) manufacturing. The methods hold promise of reducing manufacturing complexity and cost while increasing overall reliability. The resulting structures can also be made smaller, lighter and more environmentally friendly than those produced by traditional method. Examples of methods and technologies as well as the results of an experimental exercise wherein a circuit assembly designed using current best practices is compared to a circuit assembly which has been designed to be built without solder, using strict design guidelines will be presented.

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  UL's newservices for PWB

  Mr. Irving Lee

  Global Program Manager, Consumer Technology
  UL AG, Taiwan Branch

   Profile

  Irving Lee joined UL in 2014 as a Global Program Manager for Printed Circuit Technologies.
  Member of TPCA Market Information Committee and PCB Industrial White Paper council

  Experience ;
  1989~1993 Process Eng. & QA supervisor in Boardtek Electronics Taiwan
  1993~1998 Head of DEC Asia Pacific PWB qualification Office/Lab in Taiwan
  1998~2014 Sr. Manager in Inventec Taiwan (The Biggest Server ODM company)

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  Latest situation of UL 746/796 standards

  Ms. Crystal Vanderpan

  Principal Engineer
  PV Materials and Printed Circuit Technologies
  Product Safety
  UL LLC

   Profile

  Crystal Vanderpan joined UL in 1995, and is the Principal Engineer for Printed Circuit Technologies and PV Materials.
  She is UL's Technical Representative in developing Standards for PWBs and PV Materials. She is the vice-chair for IPC D12a UL Flex PWB task group.
  Crystal has given many presentations and written several white papers regarding PWB testing.